About Panel Cooling in LINEAR Building
Learn basic information about the structure and function of the Panel cooling module in LINEAR Building.
With the module Panel cooling in LINEAR Building, you can, based on the calculated cooling load or on standard area values, design rooms, apartments, floors or building parts automatically and compliant with the standards for panel heating systems. You can adapt the dimensioning individually as required and optimize it subsequently.
A multitude of panel cooling systems in manufacturers’ databases are available to you for the design process. In addition to floor cooling systems, these also include ceiling and wall systems. If it is planned by the manufacturer, the layer composition of the individual system components can be modified. Depending on the system, control components can also be selected. Just as with the hydraulic topology (pipe runs, manifolds, manifold connections), you can adapt the default settings and system parameters of panel cooling systems to the requirements of your project.
After the design process, the cooling circuits can be marked and connected in your CAD program. The CAD model is then connected directly with the calculation in the panel heating/cooling system module. Actually occupied panels, feed pipe lengths and the hydraulic topology are adopted from the CAD model automatically. Other adaptations, such as the laying spacing, can be made both in CAD and in the LINEAR Building.
You can also start off designing in CAD and then begin calculation in the LINEAR Building. This is useful e.g. if the architecture is intended for optimal exploitation (complex feed pipe ducting or room geometries) and determines that a CAD model is to be created.
The result is that both a detailed material list is created and comprehensive printouts offered. In addition to ensuring the comprehensibility of the design, these documents also aid in the laying of the circuits and the setting of the valves on the construction site. In addition, you can create and print labels with all the necessary information for later labeling of manifolds and connections.